Illumination devices and methods for making the same

ABSTRACT

The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of application Ser. No. 13/955,455,filed Jul. 31, 2013, which is a Continuation of application Ser. No.11/756,971, filed Jun. 1, 2007, which claims the benefit of U.S.Provisional Application No. 60/825,245, filed Sep. 11, 2006, which isincorporated by reference herein.

FIELD

The present disclosure relates to illumination devices, and moreparticularly to thin, illumination devices utilizing thin layers havingcircuitry and illumination devices and capable of being cut into variousshapes.

BACKGROUND

Illumination devices that use circuitry and light management devices areknown in the art in numerous applications. Such devices include a lightsource, and electrical circuit to power the light source and some lightmanagement device, such as a reflector or a diffuser to direct lightproduced by the light source in a desired manner. Such devices may beused, in particular, to attempt to provide illumination with minimalspace utilization particularly in the case of thin light guides or lightmanagement devices. Known light devices and fixtures used primarily forproviding illumination, however, typically utilize bulky housingscontaining lighting devices such as incandescent light bulb fixtures orsimilar lighting devices. In particular, applications, such as signs,channel letters and displays, for instance, these known illuminationdevices utilize a relatively large amount of space.

Lighting devices which employ a circuit substrate may be a fiberglasssubstrate patterned with copper circuits and mounting holes forcomponents. Such rigid circuit boards, known as FR4 circuit boards, aremade to be stiff and rigid by design. Therefore, they are not suitableto mounting onto surfaces that are not flat. Flexible circuits exist,and are typically made of patterned copper on films such as those soldunder the tradename KAPTON polyimide films. These circuits offer thebenefit of flexibility, but suffer from higher manufacturing costs. Inaddition, these circuits are typically made by a step and repeatpatterning process. Such a process provides a great deal of difficultyin aligning features on the layers and also in making connectionsbetween layers. Therefore, such a process is expensive and highmaintenance.

SUMMARY

The present disclosure is generally directed to illumination devices andmethods for making the same. In particular, the present disclosure isdirected to illumination mats having an array of LEDs. Theseillumination mats can be formed as thin composite films that areflexible and cut to any size, as desired.

In one embodiment, the device includes a first conductor layer, a firstinsulator layer disposed on the first conductor layer and having atleast one first aperture defined therein through the first insulatorlayer, a second conductor layer disposed on the first insulator layerand having at least one second aperture defined therein through thesecond conductor layer and positioned to align with the at least onefirst aperture, and a light manipulation layer disposed on the secondconductor layer and having at least one pair of apertures definedtherein through the light manipulation layer including a third apertureand a fourth aperture, where the third aperture is positioned to alignwith the at least one second and first apertures.

In another embodiment, a method of making an illumination deviceincludes disposing a first insulator layer on a first conductor layer,the first insulator layer defining at least one first aperture throughthe first insulator layer, disposing a second conductor layer on thefirst insulator layer, the first insulator layer defining at least onesecond aperture through the second conductor layer and positioned toalign with the at least one first aperture, and disposing a lightmanipulation layer defining at least one third and fourth aperturesthrough the light manipulation layer such that the at least one thirdaperture is positioned to align with the at least one first and secondapertures.

In a further embodiment, an illumination device includes a first filmlayer having a light manipulative property, a conductor pattern disposedon a side of the first film layer, and at least one light sourcedisposed on the side of the first film layer and in electricalcommunication with the conductor pattern.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective exploded view of an example of a disclosedillumination device.

FIG. 2 is an exploded side view of the device of FIG. 1.

FIG. 3 is a side view of the device of FIG.1.

FIG. 4 is a plan view of the device of FIG. 1 showing the positionalrelationship between conductor patterns of the device of FIG. 1 withoutlight emitting devices shown.

FIG. 5 is a plan view of the device of FIG. 1 showing the positionalrelationship between conductor patterns and light emitting devices ofthe device of FIG. 1.

FIG. 6 is a perspective exploded view of another example of a disclosedillumination device.

FIG. 7 illustrates an exploded cross section of the device of FIG. 6through section line 7-7.

FIG. 8 illustrates the assembled cross sectional view of the deviceillustrated in FIG. 7.

FIG. 9 is a perspective view of the assembled device of FIG. 6.

FIG. 10 is an exploded perspective view of another example of adisclosed illumination device.

FIG. 11 is a perspective view of the device of FIG. 10 shown in anassembled state.

FIG. 12 is a plan view of another example of a disclosed illuminationdevice.

DETAILED DESCRIPTION

The present disclosure features illumination devices and methods formaking such devices having thin profiles to provide lighting devicesthat are thinner and take up less space than lighting devices known inthe conventional art and are capable of being easily cut into variousshapes. Such illumination devices may be utilized in a wide variety ofapplications. One such application may be for use in situation wherespace is limited or the illumination device is desirably low profile.One such example may include illuminated signs sometimes referred to as“light boxes.” Illuminated signs are often used to enhance thepresentation of images and/or text. Examples of illuminated signs can befound in airports, mass-transit stations, shopping malls and otherpublic places, for example. The signs typically include an enclosurehaving an illuminated face over which a graphic (including images and/ortext) is located. The disclosed illumination devices may be used toaffect such types of illuminated signs by including at least one lightsource and a light transmissive device, with the device being eitherflat, at least substantially flat, or curved. The disclosed illuminationdevices may be used to illuminate channel letters where the disclosedillumination mats can be cut to fit the particular shape of the channelletter and provide uniform illumination of the channel letter. Anotherapplication is of use in backlit displays, for example, liquid crystaldisplays as may be used for active signs, televisions, and computermonitors. Another application is for use in vehicles where minimizationof size and weight is a concern.

As used herein, the term “vehicle” is defined broadly as a means ofcarrying or transporting something. Types of vehicles which may utilizethe illumination devices disclosed herein include, by way ofnon-limiting example, automobiles, trucks, buses, trains, recreationalvehicles, boats, aircraft, motorcycles, and the like.

As also used herein, the term “light source” means any solid statelighting device, including, by way of non-limiting example, LEDs,fluorescent or incandescent lamps, electroluminescent lights, and othersimilar light sources.

As used herein, the term “light transmissive layer” means any materialthat transmits or alters transmission properties of visible light.Non-limiting examples of altering properties include reflection,refraction, dispersion, diffraction, and interference.

The illumination devices disclosed herein provide lighting for use insigns, displays, vehicles or buildings that are thinner, relativelyinexpensive, more efficient, evenly illuminating, and aestheticallyattractive. These illumination devices are formed of flexible materialsthat allow the illumination device or light mat to be elasticallydeformed about a cylindrical object of any diameter such as, forexample, a diameter of 1 cm, or 2 cm, or 5 cm, or 10 cm. In manyembodiments, these illumination devices can be assembled on aroll-to-roll apparatus in film/layer format forming a continuous web ofillumination light mat that can be cut into any useful size or shape asdescribed in concurrently filed U.S. patent application Ser. No.11/756,905, incorporated by reference herein.

It is noted here that, unless otherwise noted, all parts, percentages,and ratios reported in examples described in this disclosure are on aweight basis.

When terms such as “above”, “upper”, “atop”, “upward”, “beneath”,“below”, “lower” and “downward” are used in this application to describethe location or orientation of components in an illumination device,these terms are used merely for purposes of convenience and assumingthat the viewing face of the illumination device is horizontal and isviewed from above. These terms are not meant to imply any requiredorientation for the completed illumination device or for the path takenby supplied or ambient light in actual use of the completed device.

In a basic embodiment, the device includes a circuit capable ofdelivering an electric current. The device includes an electricallyinsulating layer bonded to a conductive layer. These layers may bebonded by a permanent bond or may be removable from each other. Theconnection may be made by a number of methods. In some embodiments, theconnection is made by a mechanical process. That is, the bond is formedbetween two separate layers, and the conductive layer is not chemicallydeposited onto the electrically insulating layer. For example, alamination process or joining the electrically insulating layer and theconductive layer together with an adhesive. As described above, thedevice may include a bottom film covering the multilayer circuit. Thebottom film may be an additional electrically insulating layer or aseparate polymer film, or a combination of both.

FIG. 1 illustrates an example of an illumination device 10 according tothe present disclosure. Device 10 is shown having a first layer 12,which may be either flexible or rigid. In many embodiments first layer12 is a multi layer film having light reflective properties, such as areflector material. It is noted that reflector materials impart variousqualities to the light, such as color or reflective properties (i.e.,mirror). Reflector materials may be mirror films, opaque films or othermaterials capable of light reflection. An example of suitable highreflectivity materials include Vikuiti™ Enhanced Specular Reflector(ESR) multilayer polymeric film available from 3M Company; a film madeby laminating a barium sulfate-loaded polyethylene terephthalate film (2mils thick) to Vikuiti™ ESR film using a 0.4 mil thick isooctylacrylateacrylic acid pressure sensitive adhesive, the resulting laminate filmreferred to herein as “EDR II” film; E-60 series Lumirror™ polyesterfilm available from Toray Industries, Inc.; Light Enhancement Film3635-100 (LEF) available from 3M Company, porous polytetrafluoroethylene(PTFE) films, such as those available from W. L. Gore & Associates,Inc.; Spectralon™ reflectance material available from Labsphere, Inc.;Miro™ anodized aluminum films (including Miro™ 2 film) available fromAlanod Aluminum-Veredlung GmbH & Co.; MCPET high reflectivity foamedsheeting from Furukawa Electric Co., Ltd.; and White Refstar™ films andMT films available from Mitsui Chemicals, Inc. Layer 12 could also betranslucent or transparent if it were combined with layer 16 being thereflector.

A first conductor pattern 14 is disposed on a surface of the first layer12. The conductor pattern 14 may include conductive ink, such as silverink, or a thin conductor pattern, such as copper or aluminum foil, or acombination thereof (e.g., plating conductive ink with copper or similarconductive metal). In some embodiments, the conductor pattern 14 isformed in selected patterns by screen printing, shadow masking,photolithography, etching, ablating, or laser induced thermal imaging,as examples. In many embodiments, the conductor pattern may be formed bya electrically conductive sheet such as copper or aluminum foil, forexample, that may be continuous or patterned, for example by rotary diecutting, laser patterning, water jet cutting, or other cutting wayscommercially available. This conductive pattern 14 may be a separatelayer, laminated onto the surface of the first layer 12, or alternately,be positioned and secured between layers 12 and 16 and then bondedtogether. Circuit configurations may include busses in grid pattern asillustrated in FIG. 1, or any other desired pattern.

Device 10 further includes a second layer 16 configured to engage withthe first layer 14. In some embodiments, the second layer 16 is composedof a transparent polyester film, or any other suitable film whichaffords light transmission, whether transparent, semi-transparent, ortranslucent. In many embodiments, layer 16 is a reflector film, asdescribed above, either to replace the reflector base film layer 12 orenhance it. In some embodiments, either the bottom surface of secondlayer 16 engaging with the upper surface of first layer 12, or the uppersurface of first layer 12 having the conductor pattern 14 includes anadhesive (that can be light transmissive), that is used to affix thefirst and second layers 12, 16 together. In many embodiments, the layers12 and 16 are laminated together to form an integral device.

The second layer 16 includes a second conductor pattern 18, which isconfigured and assembled similar to the first conductor pattern 14,discussed above. Second layer 16 also includes one or more apertures orvias 20 that are located so as to align with portions of first conductorpattern 14 when the first and second layers 12 and 16 are conjoined,allowing access to first conductor pattern 14 from the upper surface ofsecond layer 16, as will be discussed more fully in connection withFIGS. 2-5.

It is further noted that layer 16 is shown as a film, but may also be aprinted layer.

Device 10 also includes one or more light or illumination sources 22,which may be one or more light emitting diodes (LEDs) having twocontacts (i.e., an anode and cathode), but are not limited to such.Examples of LEDs that may be used include LEDs of various colors such aswhite, red, orange, amber, yellow, green, blue, purple, or any othercolor of LEDs known in the art. The LEDs may also be of types that emitmultiple colors dependent on the polarity of the applied power, or oftypes that emit infrared or ultraviolet light. Furthermore, the LEDs mayinclude various types of packaged LEDs or bare LED die, as well asmonolithic circuit board type devices or a configuration using circuitleads or wires. As indicated in FIG. 1, the light sources 22 are locatedsuch that at least a portion of the light source 22 is over theapertures 20. This allows one of the contacts of a light source 22 tocontact or be electrical communication with the first conductor 14through the apertures 20. The other contact of the light source 22 is inelectrical communication with second conductor pattern 18. Accordingly,a source of power, such as a voltage source 24, may then be connectedacross the first and second conductor pattern 14 and 18, as illustrated,to supply power to drive the light sources 22.

FIG. 2 is an exploded side view of the device 10 of FIG. 1 and likereference numerals refer to the same elements as shown in FIG. 1. As maybe seen in FIG. 2, the first layer 12 includes one or more conductorpatterns 14 disposed on an upper surface thereof. In the exampleillustrated, the conductor patterns 14 may be composed of conductive inktraces 26 plated with copper or copper foil 28, as described above. Aportion of the light sources 22 may then make electrical connection orcommunication with the conductor pattern 14 through the apertures 20 asindicated by an arrow 30. It is noted here that the dimensions of theelements of device 10 illustrated in the figures is not exact, butmerely illustrates the disclosed arrangement of elements. Accordingly,the thicknesses of layers 12 and 16 and conductor patterns 14 and 18 aregreater than would be utilized in practice. Thus, the distance to whichone of the contacts of light source 22 extends through via 20 in orderto make contact with conductor pattern 14 is small and a protrusion,extension, or lead from light source 22 to make contact with pattern 14may not be necessary. Alternately, it is possible that resistors, orresistive material can be bonded or deposited into the apertures inorder to bring the lower contact pattern into proximity with the uppercontact pattern. This would serve the additional function of providing acurrent limiting resistance for each LED. Alternately, the resistivematerial can be selected to have a positive temperature coefficient,which could provide the additional benefit of further limiting currentto each LED based on ambient and LED temperatures.

FIG. 3 illustrates an assembled side view of the device 10 of FIG. 1showing the conjoining of layers 12 and 16. As mentioned above, thedimensions of the figures are not intended to illustrate exactdimensions and the degree of distance for electrical contact orcommunication of the light source with pattern 14 is small. Nonetheless,FIG. 3 illustrates electrical connection with connections 32(representational only and not intended to illustrate a specificphysical connection) of a portion 34 of light source 22 to conductorpattern 14. Another portion 36 of light source 22 is in electricalcontact or communication with conductor pattern 18. It is noted that thepatterns 14 and 18 may be offset as illustrated in FIGS. 2 and 3, or mayalternatively be located directly one over the other. In such case, theapertures 20 may be located within pattern 18, but electricallyinsulated from the circuit of pattern 18 and also not affecting circuitcontinuity of pattern 18.

It is noted that light extraction from the one or more light sources 22may also be enhanced by encapsulating, coating or applying a lighttransmissive film over the light sources 22 in order to improveextraction efficiency at the surface of an LED, for example, bydefeating total internal reflection at the LED/light transmissiveinterface, and/or to provide protection to the light sources 22. Thismay be accomplished by providing uniform light distribution by guidinglight within the encapsulating material or coating using total internalreflection. Furthermore, diffuse light distribution from within themedium by reflection or scattering may be produced by incorporatingnanoparticles, glass microspheres, metal powder, chopped ESR, or Bragggratings, as examples. Additional directed light distribution fromwithin the medium may be achieved using prismatic or microstructuredsurfaces, lenslet arrays, shaped ribs, or random chaotic surfacepatterns, as examples.

FIG. 4 is an illustrative plan view of the device of FIG. 1 showing anexemplary positional relationship between conductive traces of thedevice of FIG. 1 without light sources shown. In particular, theconductor grid pattern 18 is located above conductor grid pattern 14 andis at the same height as apertures 20. As may be seen, the apertures 20are positioned such that they are directly located over pattern 14 whendevice 10 is assembled. This is illustrated by the conductor pattern 14intersecting the apertures 20.

FIG. 5 shows the plan view of the device 10 illustrated in FIG. 1 andFIG. 4 showing the positional relationship between conductive traces andlight emitting devices or sources 22 (see also FIGS. 2 and 3). As shown,each light source 22 has a portion 34 positioned over an aperture 20 toeffect contact of the light source with conductor pattern 14 through theaperture 20. Another portion 36 of each light source 22 is positioned toelectrically contact conductor pattern 18.

When the exemplary device 10 is assembled, as shown in FIG. 3, forexample, the light reflective surface of the first layer 12 serves toproject the light in a direction away from the upper surface of thesecond layer as shown in FIG. 3. Moreover, by utilizing a grid array orsimilar variant, the device 10 may be cut to form desired cut patterns.Power is then simply applied across the first and second layers to causethe light sources 22 to illuminate. In an alternative example, it iscontemplated that device 10 may be implemented by simply printingcircuit patterns or traces on both sides or surfaces of a lightmanipulating film. This would yield, for example, a “positive” side onone surface and the “negative” side of the circuit on the other side. Bypositioning LEDs to connect between the circuits via apertures 20utilizes the dielectric nature of the coated sheet to allow intersectingcircuit patterns. Using this methodology engenders the ability toproduce a light mat that can be cut into any desired pattern and thenpowered simply by connecting to any point on the top and another pointon the bottom.

In another alternative, a similar structure to device 10 can be producedon a single side of a sheet by first printing and plating a firstcircuit or conductor pattern. This is followed by printing a dielectriclayer having apertures over at least a portion of the first circuit.Next, a second printed and plated circuit is disposed on top of thedielectric layer. Illumination sources (e.g., LEDs) are then be mounted,in part, through the openings in the dielectric such that they connectboth the first and second conductive layers or patterns.

FIGS. 6-9 disclose yet another example of a light source according tothe present disclosure, which includes using a metal foil, rather thanconductor patterns. FIG. 6 illustrates a perspective view of anillumination device 40 having multiple layers. A first conductor layer42 may consist of a metal foil, such as a copper foil or other suitableconductor fashionable as a sheet or layer. Disposed on the firstconductor layer 42 is a first electrical insulator or non-conductivelayer 44. In some embodiments, another electrical insulating ornon-conducting layer can be disposed beneath the first conductive layer42, sandwiching the conductive layer 42 between the two non-conductivelayers. The first electrical insulator layer 44 includes one or moreapertures 46 through the layer. The first electrical insulator layer 44may consist of any known electrical insulator or dielectric capable ofbeing fashioned as a sheet or layer, or a light reflective layer, asdescribed above. Additionally, layer 44 may include an adhesive on oneor both sides for adhering layer 44 to adjoining layers such as firstconductor layer 42.

Device 40 further includes a second conductor layer 48 disposed on theupper surface of first electrical insulator layer 44. Second conductivelayer 48 includes one or more apertures 50 through the layer and mayconsist of a metal foil, such as a copper foil or other suitableconductor fashionable as a sheet or layer. Apertures 50 and 46 areconfigured to align or be in register with each other. Finally, device40 includes an optical film layer 52. Optical film layer 52 may consistof a reflective material or have some other light manipulative property,as the light reflective films described above. Layer 52 includes one ormore pairs of apertures 54, each pair 54 having first 56 and second 58apertures. First aperture 56 aligns with or is in register with holes 46and 50 in the first conductor layer 44 and the second conductive layer50, respectively. FIG. 6 shows this alignment with vertical dashed line.Thus, an illumination source having at least two terminals, such as anLED with anode and cathode terminals, disposed on the upper surface oflayer 52 may make electrical contact with first conductor layer 42through apertures 56, 50, and 46. The other terminal of the lightillumination source can be in electrical communication with the secondconductor layer 48 through apertures 58. In some embodiments, layer 52includes a single large aperture that replaces each pair 54 of first 56and second 58 apertures.

Device 40 also includes one or more light or illumination sources 60,which may be one or more light emitting diodes (LEDs) having twocontacts (i.e., an anode and cathode), but are not limited to such.Examples of LEDs that may be used include LEDs of various colors such aswhite, red, orange, amber, yellow, green, blue, purple, or any othercolor of LEDs known in the art. The LEDs may also be of types that emitmultiple colors dependent on whether forward or reverse biased, or oftypes that emit infrared or ultraviolet light. Furthermore, the LEDs mayinclude various types of packaged LEDs or bare LED die, as well asmonolithic circuit board type devices or a configuration using circuitleads or wires.

It is noted that either the upper surface of second conductor layer 48or the bottom surface of the optical film layer 52 may include anadhesive to affix layers 48 and 52 together. Additionally, the layers ofassembled device 40 are laminated together to achieve a unitaryconstruction.

FIG. 7 illustrates an exploded cross section of the device of FIG. 6through section line 7-7 extending the entire vertical cross sectiondistance of device 40. As illustrated, a portion 62 of an illuminationsource 60 is positioned over aligned apertures 56, 50, and 46 to allowelectrical communication between portion 62 and the first conductorlayer 42. Another portion 64 of the illumination devices 60 ispositioned over aperture 58, affording electrical communication betweenportion 64 and second conductive layer 48. Accordingly, a source ofpower, such as a voltage source 66, may then be connected across thefirst and second conductor layers 42 and 48, as illustrated, to supplypower to drive the illumination source 60.

FIG. 8 illustrates the assembled cross section view of the device 40illustrated in FIG. 7. As shown, FIG. 8 illustrates an assembled deviceshowing the layered construction including layers 42, 44, 48, and 52. Asmentioned previously, the dimensions of the figures are not intended toillustrate exact dimensions and the degree of distances for electricalcontact or communication of the light source 60 with the first andsecond conductor layers 42 and 48 are small. Nonetheless, FIG. 8illustrates electrical connection with connections 68 and 70(representational only and not intended to illustrate a specificphysical connection) of portions 62 and 64 of light source 60 to layers42 and 48, respectively.

FIG. 9 is a perspective view of the assembled device 40 of FIG. 6,illustrating that the illumination sources 60 are disposed on the uppersurface of device 40 connected across the pair of apertures 56 and 58.

FIG. 10 is an exploded perspective view of another example of adisclosed illumination device 80. As illustrated, the device 80 includesa carrier film 82, which may be electrically insulating. Disposed on thecarrier film 82 is one or more pair of metal foil strips 84, such ascopper foil. Disposed on the film 82 and strips 84 is a lightmanipulative film 86, such as a reflective film (e.g., any of thereflective films discussed previously herein). The film 86 includes atleast a first pair of holes 88 or 89, each of the holes in pair 88 or 89aligning with respective strips of the pair of strips 84. Anillumination source, such as an LED 90 (shown in FIG. 11) may then bepositioned over the holes 88 to respectively communicate with positiveand negative potentials of a power supply connected to the strips 84.

FIG. 11 is a perspective view of the device of FIG. 10 shown in anassembled state.

These figures further illustrate that layer 86 includes at least two ormore pair of holes correspondingly aligned to a respective pair of foilstrips 84 may be jumpered by conductors 92 (above or below the layer 86)to provide power to one or more additional groups of light sourceselectrically communicated with a pair of foil strips 84. Thus, thedevice 80 may fashioned in a sheet and cut to a desired size, and onlyone power supply or access connection 94 is needed for the device withan appropriate number of conductor jumpers 92 to power all LEDs in thecut sheet.

It is noted that the layers of device 80 may be laminated all together,place LED attach electrical connections.

The devices disclosed herein can include more conductive layers andinsulating layers than is illustrated in the figures, depending on thenature of desired circuit or number of circuits on each device. Forexample, a further insulating layer can be laminated between twoadditional conductive layers to produce a second circuit on each device.

FIG. 12 is a plan view of another example of a disclosed illuminationdevice 100. This device 100 can be printed on a reflective film 102using a silver-based conductive ink to create conductor patterns 104.Copper can then be plated onto the conductive ink using standardelectrochemical plating processes. Light sources such as LEDs can besoldered across the gaps 106 creating a parallel circuit that can bepowered from either end. With this method the conductivity of thecircuit was increased by the plating process from 5.5 ohms for inkprinted to 0.5 ohms for the ink with plating. The higher conductivityallowed mounting and lighting of the entire string of LEDs where acircuit prepared by printing only would only brightly light the first 1or 2 LEDs. This circuit is built on reflective films such as weredescribed above

The exemplary structures and methods described above may be used asillustrated, or in combinations. That is, an alternative could include alower conductor pattern made of copper foil and an upper circuit orconductor pattern printed on an optical film. In another alternative,the lower circuit could be printed and the upper circuit could be acopper foil.

It is noted that instead of copper foil for a conductor patterns orlayers, aluminum or other conductive metal foil may be utilized.Furthermore, in place of foil, it is contemplated that polyester coatedwith a metallic conductor may also be utilized. Moreover, all of thedisclosed layers could be implemented by films laminated together orcoatings printed on top each other.

The illumination devices described herein provide relatively thinillumination devices that are particularly useful for illuminationapplications where the thickness of the illumination element is desiredto be minimized. In some embodiments, the total thickness of theillumination device or mat (excluding the light source) is in a rangefrom 100 micrometers to 2000 micrometers, or from 100 micrometers to1000 micrometers, or from 250 micrometers to 750 micrometers. Theplurality of layers that form the illumination devices or mats describedherein can have any useful thickness. In many embodiments, the conductorlayers have a thickness in a range from 10 micrometers to 50micrometers, or from 20 micrometers to 30 micrometers, and the insulatorlayers and/or light manipulation layers (including optional adhesivelayer of 10 to 30 micrometers) each have a thickness in a range from 25micrometers to 250 micrometers, or from 25 micrometers to 150micrometers. In many embodiments, the light source is an LED having athickness in a range from 75 micrometers or greater.

The illumination devices described herein provide lighting devices thatare capable of being cut to various desired shapes. The shapes mayinclude linear shapes or shapes that are more complex. Such illuminationdevices are suitable for use in a variety of applications forilluminating surfaces, such as the interior or exterior surfaces ofvehicles as an example. In addition, the disclosed illumination devicesmay be used in other applications such as interior or exterior lightingfor buildings, backlighting signs, and displays, as was mentionedpreviously.

The illumination devices described herein can have one or moreelectrical circuits that power the lights sources. In many embodiments,the electrical circuits are parallel electrical circuits. In someembodiments, the electrical circuits are a plurality of parallelcircuits that allow the illumination device or mat to be cut along thelength and/or width of the illumination device or mat while stillallowing the circuits to be electrically coupled to a voltage source andpower the light sources.

The illumination devices described herein are suitable for use on anysurface of a vehicle traditionally provided with lighting such asoverhead dome lighting, glove box lighting, floor lighting, map lights,mirror lights, decorative lights, rear window brake lights, and thelike. In addition, the illumination devices described herein aresuitable for providing lighting in places where prior art lightingsystems would be difficult or impractical. Due to the thin constructionof the devices and the configuration of the light source, theillumination devices of the present disclosure may be installed inconfined spaces. In addition, the illumination devices of the presentdisclosure may be installed in light boxes for advertising, includingsign boxes, channel letters, and the like. Due to the flexibleconstruction, the illumination devices described herein may be installedon curved surfaces.

The illumination devices described herein are also suitable for displayapplications. These illumination devices are particularly useful as abacklight or edge light for a liquid crystal display panel, as may beused for advertising display, TV, DVD, or computer monitor applications.

As one skilled in the art will appreciate, varieties of combinations ofthe components described herein are possible to provide suitableillumination devices. For example, it is anticipated that the discloseddevices of the present disclosure may be formed from other flexiblematerials, as well as the conductive regions, layers and patterns beingconstructed from flexible materials. For example, copper etched circuitson polyester teraphthalate (PET) or polyamide such as those obtainedunder the trade designations “Flexible Circuits” from 3M Company.Transparent conductive regions may also be prepared by pattern sputtercoating indium tin oxide (ITO) on a polyester film, obtained from CPFilms, Inc., Martinsville Va. Another option for creating conductiveregion patterns is to laser ablate or etch the patterns from a fullsheet of ITO coated polyester.

It is further contemplated that the illumination devices of the presentdisclosure may subsequently be molded into various illuminatedartifacts, including, but not limited to, buttons, coffee cups, trafficdelineators, window housings, body side moldings, bumper covers,furniture, countertops, toilet seats, shower doors, and the like.

It is still further contemplated that the disclosed illumination devicesmay alternately be coated with other suitable materials to protect theLEDs and provide index matching, including acrylic resins, polyvinylbutyral polymer, polyolefin resins, epoxy resins or silicone resins,etc. The resin could be filled with diffusing components such as glassbeads, silica particles, fibers, or pigments.

While the illumination devices depicted in the figures show the devicesas substantially planar articles, it should be appreciated that thedevices may be constructed as a curved article. As one skilled in theart will appreciate, various combinations of the light managementdevices could be utilized with various configurations of light sourcesto produce an illumination device. Further, as one skilled in the artwould appreciate, the entire structures shown herein may be encased in ahousing.

The optical qualities of the illumination devices described herein maybe further enhanced by the use of additional light management films orlayers. Suitable light management devices for use in the illuminationdevices described herein include, light control films for glare andreflection management, prismatic brightness enhancement films, diffuserfilms, reflective films, reflective polarizer brightness enhancementfilms, reflectors and turning films, and liquid crystal display panels.

It is further noted that the whole constructions of the devicesdescribed herein may include adhesive on either the back or frontsurfaces thereof to attach the device to some other structure.

The present disclosure also incorporates by reference pending PCTapplication number US2006/008781 filed Mar. 10, 2006 and entitled“ILLUMINATION DEVICES AND METHODS FOR MAKING THE SAME.”

One skilled in the art will also appreciate that light sources used inthe devices described herein can be provided in a variety of forms. Thelight source may be, for example, a linear or non-liner array of one ormore LEDs, or other form of light source such as fluorescent orincandescent lamps, electroluminescent lights and the like. In otherexamples, a matrix or grid of LED lights may be used. In some examples,the light may be colored. In still other examples there may be more thanone light source provided in the illumination device. The light sourcemay include a dimmable control, on/off control, color control and thelike.

In light of the foregoing, the present disclosure provides illuminationdevices that are thin, efficient, evenly illuminating, and aestheticallyattractive. Additionally, aspects of the disclosed illumination devicesafford ease of use, such as easy attachment to surfaces such asautomobile windows and other interior or exterior surfaces, or displaysurface.

The above-detailed examples have been presented for the purposes ofillustration and description only and not by limitation. It is thereforecontemplated that the present disclosure cover any additionalmodifications, variations, or equivalents that fall with in the spiritand scope of the basic underlying principles disclosed above and theappended claims.

What is claimed is:
 1. An illumination device comprising: a firstconductor layer; a first insulator layer disposed on the first conductorlayer and having at least one first aperture defined therein through thefirst insulator layer; a second conductor layer disposed on the firstinsulator layer and having at least one second aperture defined thereinthrough the second conductor layer and positioned to align with the atleast one first aperture; a light manipulation layer disposed on thesecond conductor layer and having at least one pair of apertures definedtherein through the light manipulation layer including a third apertureand a fourth aperture, where the third aperture is positioned to alignwith the at least one second and first apertures, at least one lightsource disposed on the first conductor layer in electrical communicationwith the second conductor layer pattern through the first aperture,wherein the total thickness of the first conductor layer, the firstinsulator layer, the second conductor layer, and the light manipulationlayer is 100 micrometers to 1000 micrometers.
 2. An illumination deviceaccording to claim 1, wherein at least one of the first and secondconductors comprises a metal conductor comprised of least one of copper,silver, gold, aluminum, palladium, and titanium.
 3. An illuminationdevice according to claim 1, wherein the device is substantially planarin shape.
 4. An illumination device according to claim 1, wherein thedevice is curved.
 5. An illumination device according to claim 1 incombination with art illuminated sign, building, vehicle, or display. 6.An illumination device according to claim 1, wherein the lightmanipulation layer is a light reflective layer.
 7. An illuminationdevice according to claim 1, wherein the light manipulation layer is apolymeric mirror film.
 8. An illumination device according to claim 1,wherein the first insulator layer comprises a plurality of firstapertures defined therein through the first insulator layer and aplurality of second apertures defined through the second conductor layerand positioned in registration with the plurality of first apertures anda plurality of third apertures and a plurality of fourth aperturesdefined in the light manipulation layer where the plurality of thirdapertures are in registration with the plurality of second apertures. 9.A method of making an illumination device comprising: disposing a firstinsulator layer on a first conductor layer, the first insulator layerdefining at least one first aperture through the first insulator layer;disposing a second conductor layer on the first insulator layer, thefirst insulator layer defining at least one second aperture through thesecond conductor layer and positioned to align with the at least onefirst aperture; and disposing a light manipulation layer defining atleast one third and fourth apertures through the light manipulationlayer such that the at least one third aperture is positioned to alignwith the at least one first and second apertures, wherein the totalthickness of the first conductor layer, the first insulator layer, thesecond conductor layer, and the light manipulation layer is 100micrometers to 1000 micrometers.
 10. A method according to claim 9,wherein the light manipulation layer is a light reflective layer.
 11. Amethod according to claim 9, wherein the light manipulation layer is apolymeric mirror film.
 12. A method according to claim 9, wherein thefirst insulator layer comprises a plurality of first apertures definedtherein through the first insulator layer and a plurality of secondapertures defined through the second conductor layer and positioned inregistration with the plurality of first apertures and a plurality ofthird apertures and a plurality of fourth apertures defined in the lightmanipulation layer where the plurality of third apertures are inregistration with the plurality of second apertures.
 13. An illuminationdevice comprising: a first conductor layer; a first insulator layerdisposed on the first conductor layer and having at least one firstaperture defined therein through the first insulator layer, wherein thefirst insulator layer is a light reflective layer; a second conductorlayer disposed on the first insulator layer and having at least onesecond aperture defined therein through the second conductor layer andpositioned to align with the at least one first aperture; a transparentlayer disposed on the second conductor layer and having at least onepair of apertures defined therein through the transparent layerincluding a third aperture and a fourth aperture, where the thirdaperture is positioned to align with the at least one second and firstapertures, and at least one light source disposed on the first conductorlayer in electrical communication with the second conductor layerpattern through the first aperture.